Release Notes for

STM32 Touch-Sensing Driver

Copyright © 2011 STMicroelectronics

 

Contents

  1. Update History
  2. License

Update History


V0.1.5 / 18-November-2011

Main changes

  • Driver updated with new license agreement
  • Modif user manual (memory footprint updated)

Toolchains and Compilers used during validation

  • KEIL µVision version 4.22a
  • IAR EWARM version 6.30.1
  • TrueSTUDIO version 2.1.0
  • TASKING version 4.0r1

Known limitations

  • If the DxS feature is enabled, the Debounce Filter must be >= 1 (i.e. if at least 2 channels have their DxSGroup parameter different from 0).
  • The Recalibration timeout is 1s accurate (i.e. for 2s specified, the RecalTimeout will be between 1s and 2s).
  • Inlining functions are not yet supported by IAR compiler when referencing global variables. USE_INLINED_FUNCTIONS has also no effect when IAR compiler is used.
  • The 3 electrodes of a MCKey must have the same channel number.
  • Only the interlaced electrodes layout is supported for MCKeys.
  • The GROUP6 (PB4 and PB5) is not usable due to a poor sensitivity.
  • Only channels relating to the STM32L15x low density devices (6/8/B marking) are supported even on high density devices (C/D marking).

V0.1.4 / 16-November-2011

Main changes

  • Add directive for TASKING compiler in stm32l15x_tsl_acquisition.c file
  • GPIO OTYPER and GPIO PUPDR are not well assigned in stm32l15x_tsl_acquisition.c file
  • The COMP clock is enabled in the void TSL_IO_Init(void) function of the stm32l15x_tsl_ct_acquisition.c file when accesses to RI registers are performed

Toolchains and Compilers used during validation

  • KEIL µVision version 4.22a
  • IAR EWARM version 6.30.1
  • TrueSTUDIO version 2.1.0
  • TASKING version 4.0r1

Known limitations

  • If the DxS feature is enabled, the Debounce Filter must be >= 1 (i.e. if at least 2 channels have their DxSGroup parameter different from 0).
  • The Recalibration timeout is 1s accurate (i.e. for 2s specified, the RecalTimeout will be between 1s and 2s).
  • Inlining functions are not yet supported by IAR compiler when referencing global variables. USE_INLINED_FUNCTIONS has also no effect when IAR compiler is used.
  • The 3 electrodes of a MCKey must have the same channel number.
  • Only the interlaced electrodes layout is supported for MCKeys.
  • The GROUP6 (PB4 and PB5) is not usable due to a poor sensitivity.
  • Only channels relating to the STM32L15x low density devices (6/8/B marking) are supported even on high density devices (C/D marking).


V0.1.3 / 23-September-2011

Main changes

  • Add directive for GNU C compiler in stm32l15x_tsl_acquisition.c file
  • Update STM32L15x channel table of MCU resources section of the user manual (.chm)

Toolchains and Compilers used during validation

  • KEIL µVision version 4.03
  • IAR EWARM version 6.21.1

Known limitations

  • If the DxS feature is enabled, the Debounce Filter must be >= 1 (i.e. if at least 2 channels have their DxSGroup parameter different from 0).
  • The Recalibration timeout is 1s accurate (i.e. for 2s specified, the RecalTimeout will be between 1s and 2s).
  • Inlining functions are not yet supported by IAR compiler when referencing global variables. USE_INLINED_FUNCTIONS has also no effect when IAR compiler is used.
  • The 3 electrodes of a MCKey must have the same channel number.
  • Only the interlaced electrodes layout is supported for MCKeys.
  • The GROUP6 (PB4 and PB5) is not usable due to a poor sensitivity.
  • Only channels relating to the STM32L15x low density devices (6/8/B marking) are supported even on high density devices (C/D marking).

V0.1.2 / 02-September-2011

Main changes

  • Bug correction in stm32l15x_tsl_services.c file (ECSTimeStepCounter variable was decremented below its minimum value (0)).
  • Bug correction in stm32l15x_tsl_singlechannelkey.c file (Channel_P3.EnabledChannels was badly affected).
  • Bug correction in stm32l15x_tsl_checkconfig.h file (shield masks for PB4 was wrong).

Toolchains and Compilers used during validation

  • KEIL µVision version 4.03
  • IAR EWARM version 6.21.1

Known limitations

  • If the DxS feature is enabled, the Debounce Filter must be >= 1 (i.e. if at least 2 channels have their DxSGroup parameter different from 0).
  • The Recalibration timeout is 1s accurate (i.e. for 2s specified, the RecalTimeout will be between 1s and 2s).
  • Inlining functions are not yet supported by IAR compiler when referencing global variables. USE_INLINED_FUNCTIONS has also no effect when IAR compiler is used.
  • The 3 electrodes of a MCKey must have the same channel number.
  • Only the interlaced electrodes layout is supported for MCKeys.
  • The GROUP6 (PB4 and PB5) is not usable due to a poor sensitivity.
  • Only channels relating to the STM32L15x low density devices (6/8/B marking) are supported even on high density devices (C/D marking).

V0.1.1 / 20-April-2011

Main changes

  • Bug correction in stm32l15x_tsl_ct_acquisition.c file (RI->HYSCR1 badly configured).

Toolchains and Compilers used during validation

  • KEIL µVision version 4.03
  • IAR EWARM version 6.10.5

  

Known limitations

  • If the DxS feature is enabled, the Debounce Filter must be >= 1 (i.e. if at least 2 channels have their DxSGroup parameter different from 0).
  • The Recalibration timeout is 1s accurate (i.e. for 2s specified, the RecalTimeout will be between 1s and 2s).
  • Inlining functions are not yet supported by IAR compiler when referencing global variables. USE_INLINED_FUNCTIONS has also no effect when IAR compiler is used.
  • The 3 electrodes of a MCKey must have the same channel number.
  • Only the interlaced electrodes layout is supported for MCKeys.
  • The GROUP6 (PB4 and PB5) is not usable due to a poor sensitivity.
  • Only channels relating to the STM32L15x low density devices (6/8/B marking) are supported even on high density devices (C/D marking).

V0.1.0 / 08-April-2011

Main changes

  • First Beta release.
  • Bugs correction and enhancements:
  • correct the GPIO clock setting in TSL_IO_Init().
  • add missing enable/disable interrupt in TSL_IO_Acquisition_P1/2/3().
  • add support of the shield with one pin.
  • remove TSL_RefKey_Process() and TSL_SCKey_SetAcquisitionMasks() functions (not used).
  • replace uint8_t and uint32_t by unsigned in bit fields structures.
  • remove the RTOS feature (not used).
  • remove DriveMask and RejectedNb elements of TOUCH_PORT_Info_T structure (not used).
  • remove unused constants related to RC acquisition.
  • add wait delay during acquisition (CLWHTA and CLWLTA constants).
  • support of the PROTECT_IO_ACCESS feature.
  • remove IT_SYNC feature (not used) in the configuration file.
  • change the device name supported in the configuration file.
  • remove MCKEYx_LAYOUT_TYPE in the configuration file.
  • rename PIN_SHIELD by ACTIVE_SHIELD_CHANNEL in the configuration file.
  • code clean-up.
        

Toolchains and Compilers used during validation

  • KEIL µVision version 4.03
  • IAR EWARM version 6.10.5
     

Known limitations

  • If the DxS feature is enabled, the Debounce Filter must be >= 1 (i.e. if at least 2 channels have their DxSGroup parameter different from 0).
  • The Recalibration timeout is 1s accurate (i.e. for 2s specified, the RecalTimeout will be between 1s and 2s).
  • Inlining functions are not yet supported by IAR compiler when referencing global variables. USE_INLINED_FUNCTIONS has also no effect when IAR compiler is used.
  • The 3 electrodes of a MCKey must have the same channel number.
  • Only the interlaced electrodes layout is supported for MCKeys.
  • The GROUP6 (PB4 and PB5) is not usable due to a poor sensitivity.
  • Only channels relating to the STM32L15x low density devices (6/8/B marking) are supported even on high density devices (C/D marking).

         

     

 

License

The use of this Firmware is governed by the terms and conditions of the License Agreement available in the root of this package.

 



For complete documentation on STMTouch Microcontrollers visit www.st.com/STMTouch

For complete documentation on STM32L (CORTEX M3) 32-Bit Microcontrollers visit www.st.com/STM32L